Amazon Web Services’ Network Products Development team is looking for experienced hardware engineering professionals to help build our next generation networking platforms. The right candidate will play a key role in the design and development of our next generation Ethernet switching platforms for our world class datacenters. Strong experience in modular chassis based enterprise/carrier products is a must. The ideal candidate is a strong hardware board designer with Ethernet networking experience in the areas of terabit switch fabrics, 10/40/100 gigabit interfaces, embedded CPU subsystems, and network processors. Previous experience in defining and designing modular chassis based products is required. Must have previous experience working with Asian ODM and JDM partners, both in development and in manufacturing. You will have previous experience in high speed digital design, as a design lead in the networking field. This includes architectural definition, specification, key component selection, detailed design, working closely with PCB designers, testing, and transition to manufacturing. Applying skills in simulation, timing analysis, thermal analysis, and EMC is expected.
• BSEE • 10+ years experience in hardware board and systems development, must have taken products from concept to mass production • Experience with Ethernet switching fabrics, Ethernet PHY and SerDes interfaces, embedded CPU subsytems, DDR2/DDR3/DDR4 memory design, network processors, I2C, USB • Experience in CPLD/FPGA design using VHDL or Verilog • Experience troubleshooting with oscilloscopes, logic analyzers, and specialized test equipment such as PCI analyzers and in-circuit-emulators • Good verbal and written communication skills, must be organized • Experience interfacing with cross functional teams such mechanical engineers, HW engineers, SI engineers, diagnostic engineers, and manufacturing engineers • Experienced interfacing with outside vendors and developers, particularly Asian CMs and Asian ODM/JDM partners • While position is based in Cupertino, candidate should be able to accommodate up to 33% travel to both Seattle and Asia. Candidate must be able to enter both Taiwan and China without visa issues.
• MSEE • Experience with high-speed PCB design and AC/DC PI • Prior experience with CPLD/FPGAs in implementing advanced HW control/monitoring/logging • Experience defining and implementing modular chassis functions such as system redundancy, hot-swap, power distribution, environmental control and system management • Experience in specifying mechanical enclosures • Experience in the following is an asset: analog design, signal integrity analysis, DC-DC switcher design, EDVT, and MDVT • Experience as a project and technical lead, program management skills is preferred